Wafer Tape Frames-NEXTECK
Dicing Tape,Cover Tape,Carrier Tape,Cross Winding,Packaging Reels_NEXTECK SINGAPORE PTE LTD
Wafer Cassette-NEXTECK
NEXTECK SINGAPORE PTE LTD
Dicing Tape Wafer Dicing Tapes-NEXTECK
Denka Elegrip BACKGRIND PEELING TAPE, P-5JA, 50mm*100m, CASE OF 10 ROLLS, NEW
Dicing Tape,Cover Tape,Carrier Tape,Cross Winding,Packaging Reels_NEXTECK SINGAPORE PTE LTD
Tape and Reel Packaging Standards-cover tape, carrier tapes
ELEGRIP TAPE贴背研磨胶带材料_胶带材料_贴背研磨材料-NEXTECK
Standard Dicing Tape & Ink Jet Cover Tape – Semiconductor Equipment Corporation
CN101490813B - Dicing/die-bonding tape and method for manufacturing semiconductor chip - Google Patents